As a result of our broad experience with multiple profiles over the years, our Technical Department now presents the "pyramid profile".
This profile is based on the use of several different radii in the valley and peak of the profile.
The pores of the paper are more open when it reaches the gluing area of the single facer, and the contact area is smaller, thus reducing glue consumption.
This not only cuts production costs but also improves the quality of the board produced, as no additional moisture is absorbed.
For more information contact our Technical Department
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